Title:
WARPAGE CORRECTION MATERIAL AND METHOD FOR MANUFACTURING FAN OUT-TYPE WAFER LEVEL PACKAGE
Document Type and Number:
WIPO Patent Application WO/2018/181686
Kind Code:
A1
Abstract:
[Problem] To provide a warpage correction material which can adjust the amount of warpage even at the temperature at which a fan out-type wafer level package (FO-WLP) is mounted, and at room temperature at which, for example, wafer transportation is performed, and thereby reduce the warpage of the WLP. [Solution] This warpage correction material for a fan out-type wafer level package is characterized by comprising a curable resin composition including a component that is curable by means of an active energy ray and heat, wherein when the warpage correction material is formed into a flat film-shaped cured product by curing the warpage correction material by means of the active energy ray and heat, and the linear expansion coefficient α (ppm/°C) at 25°C, the elastic modulus β (GPa) at 25°C, and the thickness γ (μm) of the cured product satisfy the following relational expression: 2000≤α×β×γ≤10000.
Inventors:
ITO HIDEYUKI (JP)
SATO KAZUYA (JP)
ARAI YASUAKI (JP)
SATO KAZUYA (JP)
ARAI YASUAKI (JP)
Application Number:
PCT/JP2018/013176
Publication Date:
October 04, 2018
Filing Date:
March 29, 2018
Export Citation:
Assignee:
TAIYO INK MFG CO LTD (JP)
International Classes:
H01L23/12; C08G59/62; H01L23/00; H01L23/29; H01L23/31
Foreign References:
| US20100252919A1 | 2010-10-07 | |||
| JP5989929B1 | 2016-09-07 | |||
| JP2016146395A | 2016-08-12 |
Attorney, Agent or Firm:
NAGAI Hiroshi et al. (JP)
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