Title:
WARPAGE PREVENTION LAMINATE FOR CURED SEALING BODY AND METHOD FOR PRODUCING CURED SEALING BODY
Document Type and Number:
WIPO Patent Application WO/2019/187247
Kind Code:
A1
Abstract:
Provided is a warpage prevention laminate for a cured sealing body, the warpage prevention laminate having a curable resin layer (I) including a thermosetting resin layer (X1), and a support layer (II) for supporting the curable resin layer (I), wherein: the thermosetting resin layer (X1) is directly laminated on the support layer (II); the adhesive force of a first surface of the curable resin layer (I) is 1.7N/25mm or more, which is a value measured when the first surface is adhered to the glass plate at 70°C, and then the curable resin layer (I) is peeled off at 23°C at a peeling angle of 180° and a peeling speed of 300 mm/min, the first surface being a surface opposite to the support layer (II); and on the first surface of the curable resin layer (I), an object to be sealed is sealed with a sealing material.
Inventors:
SATO AKINORI (JP)
KOMA YOSUKE (JP)
AKUTSU TAKASHI (JP)
KAKIUCHI YASUHIKO (JP)
OKAMOTO NAOYA (JP)
YAMADA TADATOMO (JP)
NAKAYAMA TAKEHITO (JP)
KOMA YOSUKE (JP)
AKUTSU TAKASHI (JP)
KAKIUCHI YASUHIKO (JP)
OKAMOTO NAOYA (JP)
YAMADA TADATOMO (JP)
NAKAYAMA TAKEHITO (JP)
Application Number:
PCT/JP2018/036810
Publication Date:
October 03, 2019
Filing Date:
October 02, 2018
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
C09J7/20; B32B27/20; C09J7/29; C09J7/35; C09J7/38; C09J11/06; C09J11/08; C09J201/00
Foreign References:
| JP2013201402A | 2013-10-03 | |||
| JP2013201404A | 2013-10-03 | |||
| JP2011142170A | 2011-07-21 | |||
| JP2017092335A | 2017-05-25 | |||
| JP2011102383A | 2011-05-26 |
Attorney, Agent or Firm:
OHTANI, Tamotsu et al. (JP)
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