Title:
WATER-COOLING APPARATUS, ELECTRONIC APPARATUS HAVING WATER-COOLING APPARATUS, AND WATER-COOLING METHOD
Document Type and Number:
WIPO Patent Application WO/2013/061409
Kind Code:
A1
Abstract:
A water cooling apparatus includes: a plurality of system boards (20) having an electronic component (30) mounted thereon; a cooling plate (22), which is attached to the electronic component, and has provided therein a channel (23) where a cooling medium flows; heat transfer members (20a), which extend by penetrating respective system boards; and a heat dissipating member (28), which is provided on the rear surfaces of respective system boards, and is connected to the heat transfer members. Dissipation rate of the heat dissipating member (28) is higher than that of the heat transfer members (20a).
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Inventors:
TAKASU YOICHI (JP)
Application Number:
PCT/JP2011/074584
Publication Date:
May 02, 2013
Filing Date:
October 25, 2011
Export Citation:
Assignee:
FUJITSU LTD (JP)
TAKASU YOICHI (JP)
TAKASU YOICHI (JP)
International Classes:
G06F1/20; F28F3/12; H05K7/20
Foreign References:
JP2004246615A | 2004-09-02 | |||
JPH0955459A | 1997-02-25 | |||
JP2003050645A | 2003-02-21 | |||
JPH1041444A | 1998-02-13 | |||
JP3162593U | 2010-09-09 | |||
JP2003060133A | 2003-02-28 | |||
JP2010526427A | 2010-07-29 | |||
JP2009079854A | 2009-04-16 | |||
JP2008294196A | 2008-12-04 | |||
JP2001148593A | 2001-05-29 | |||
JPH10127055A | 1998-05-15 |
Attorney, Agent or Firm:
ITOH, TADAHIKO (JP)
Tadahiko Ito (JP)
Tadahiko Ito (JP)
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Claims:
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