Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
WATER-RESISTANT PAPER AND PACKAGING CONTAINER
Document Type and Number:
WIPO Patent Application WO/2023/248981
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing: water-resistant paper that has excellent water resistance, anti-blocking properties, moldability, and heat-sealing properties; and a packaging container obtained by using the water-resistant paper. A water-resistant paper according to the present invention has a water-resistant layer as the uppermost layer on at least one surface of a paper base. The water-resistant layer has at least two melting points. The first melting point is not lower than 75°C but lower than 100°C. The second melting point is 100-120°C. The water-resistant layer contains an ethylene-(meth)acrylic acid copolymer and a copolymer of ethylene and an unsaturated hydrocarbon other than ethylene. The mass ratio (ethylene-(meth)acrylic acid copolymer/copolymer of ethylene and n unsaturated hydrocarbon other than ethylene) of the ethylene-(meth)acrylic acid copolymer with respect to the copolymer of ethylene and an unsaturated hydrocarbon other than ethylene in the water-resistant layer is 50/50 to 90/10. The coated amount of the water-resistant layer per surface is at least 3.0 g/m2. A pigment coating layer containing a pigment and a binder is provided between the paper base and the water-resistant layer.

Inventors:
MIURA TAKAHIRO (JP)
ISOZAKI TOMOFUMI (JP)
MATSUMOTO AYAKA (JP)
AKAI SAWAKO (JP)
SEGAWA TAKAKO (JP)
KONDO MITSUTAKA (JP)
JIKIBARA TAKAYUKI (JP)
Application Number:
PCT/JP2023/022622
Publication Date:
December 28, 2023
Filing Date:
June 19, 2023
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
OJI HOLDINGS CORP (JP)
International Classes:
D21H19/82; B65D65/40; D21H19/20; D21H19/22; D21H19/58; D21H19/64
Foreign References:
JP2022013542A2022-01-18
JP2019002119A2019-01-10
JP2009520117A2009-05-21
JP2001355195A2001-12-26
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
Download PDF: