Title:
WATER SOLUBLE CUTTING FLUID FOR FIXED ABRASIVE GRAIN WIRE SAW, INGOT CUTTING METHOD USING SAME, AND SUBSTRATE FOR ELECTRONIC MATERIAL OBTAINED BY MEANS OF SAME
Document Type and Number:
WIPO Patent Application WO/2014/162945
Kind Code:
A1
Abstract:
Provided are a water soluble cutting fluid for a fixed abrasive grain wire saw that has little foaming and high cutting performance, an ingot cutting method using the same, and a substrate for electronic material obtained by means of the same.
The water soluble cutting fluid for a fixed abrasive grain wire saw is characterized by containing (a) an alkylene adduct of 2,4,7,9-tetramethyl-5-decyne-4,7-diol as shown in chemical formula (1). Also provided are an ingot cutting method characterized by cutting an ingot by means of the fixed abrasive grain wire saw using the water soluble cutting fluid for a fixed abrasive grain wire saw and obtaining wafers that are electronic material substrates as well as a substrate for electronic material obtained by this cutting method.
Inventors:
SUZUKI KIYOFUMI (JP)
TAKANASHI SHINYA (JP)
TAKANASHI SHINYA (JP)
Application Number:
PCT/JP2014/058497
Publication Date:
October 09, 2014
Filing Date:
March 26, 2014
Export Citation:
Assignee:
PALACE CHEMICAL CO LTD (JP)
International Classes:
C10M173/02; B23D61/18; B24B27/06; B28D5/04; C10M105/18; C10M107/34; C10M129/08; C10M129/16; C10M133/04; C10M135/36; C10M145/26; H01L21/304; C10N30/00; C10N30/18; C10N40/22
Foreign References:
| JP2012512954A | 2012-06-07 | |||
| JP2011012249A | 2011-01-20 | |||
| JP2011102362A | 2011-05-26 | |||
| JP2011068884A | 2011-04-07 | |||
| JPS5698294A | 1981-08-07 |
Attorney, Agent or Firm:
KISARAGI ASSOCIATES (JP)
きさらぎ international patent business corporation (JP)
きさらぎ international patent business corporation (JP)
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