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Title:
WATER-SOLUBLE CUTTING FLUID FOR SLICING SILICON INGOTS
Document Type and Number:
WIPO Patent Application WO/2011/024486
Kind Code:
A1
Abstract:
In the context of cutting silicon ingots, the provided water-soluble cutting fluid is more lubricating than existing products and therefore increases cutting efficiency. The provided cutting fluid also inhibits the generation of flammable hydrogen from reactions between water and silicon, and is therefore highly safe. Furthermore, the provided cutting fluid is a low-foaming cutting fluid and therefore does not cause problems with repeated usage, such as foaming. The provided water-soluble cutting fluid for slicing silicon ingots is characterized by containing, as essential components: a monovalent or divalent aliphatic carboxylic acid (A) having a carbon number (including the carbon in the carbonyl group) between 4 and 10; and either a polyhydroxy organic acid (B) having a ΔpKa, as defined by formula (1), between 0.9 and 2.3, or a salt (BA) of said organic acid (B). (1) ΔpKa = (pKa2) − (pKa1) Here, pKa1 is the acid dissociation constant for dissociation of the first proton from the organic acid (B), an n-protic acid HnA, resulting in Hn − 1A + H+; and pKa2 is the acid dissociation constant for dissociation of the second proton, resulting in Hn − 2A + H+.

Inventors:
KODAMA AKI (JP)
KATSUKAWA YOSHITAKA (JP)
OKAMOTO TSUYOSHI (JP)
Application Number:
PCT/JP2010/005340
Publication Date:
March 03, 2011
Filing Date:
August 30, 2010
Export Citation:
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Assignee:
SANYO CHEMICAL IND LTD (JP)
KODAMA AKI (JP)
KATSUKAWA YOSHITAKA (JP)
OKAMOTO TSUYOSHI (JP)
International Classes:
C10M173/02; B28D5/04; B28D7/02; H01L21/304; C10M105/14; C10M105/18; C10M105/24; C10M105/26; C10M105/30; C10M129/04; C10M129/16; C10M129/30; C10M129/38; C10M129/52; C10N30/06; C10N40/22; C10N40/32
Domestic Patent References:
WO2009031515A12009-03-12
WO2009041443A12009-04-02
Foreign References:
JP2006096951A2006-04-13
JP2003238983A2003-08-27
JP2006182901A2006-07-13
JP2000160185A2000-06-13
Attorney, Agent or Firm:
SUGIMURA, KENJI (JP)
Kenji Sugimura (JP)
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