Title:
WATER-SOLUBLE CUTTING SOLUTION FOR FIXED ABRASIVE WIRE SAW, METHOD FOR CUTTING INGOT USING SAME, METHOD FOR RECYCLING THE SOLUTION, AND WAFER PRODUCED BY CUTTING
Document Type and Number:
WIPO Patent Application WO/2011/058929
Kind Code:
A1
Abstract:
Disclosed are: a water-soluble cutting solution for a fixed abrasive wire saw, which has high cutting performance and can prevent the generation of a hydrogen gas through the reaction between silicon and water; a method for cutting an ingot using the cutting solution; a method for recycling the cutting solution; and a wafer produced by cutting. The water-soluble cutting solution for a fixed abrasive wire saw is characterized by comprising (a) a polyether represented by formula (1), (b) at least one component selected from glycol and a low-molecular-weight glycol ether having a molecular weight of 100 to 300, and (c) water, wherein the content ratio of the component (a) to the component (b) is 1:99 to 50:50 and the content of the component (c) is 5 to 50 wt%. C4H9O(EO)m(AO)nR1 (1) (In the formula, R1 represents a hydrogen atom or an alkyl or alkenyl group having 1 to 8 carbon atoms; EO represents an oxyethylene group; AO represents an oxyalkylene group having 3 to 4 carbon atoms; and m and n are the molar addition numbers and independently represent 1 to 20.)
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Inventors:
YOSHIDA TANEJIRO (JP)
SUZUKI KIYOFUMI (JP)
SUZUKI KIYOFUMI (JP)
Application Number:
PCT/JP2010/069716
Publication Date:
May 19, 2011
Filing Date:
November 05, 2010
Export Citation:
Assignee:
PALACE CHEMICAL CO LTD (JP)
YOSHIDA TANEJIRO (JP)
SUZUKI KIYOFUMI (JP)
YOSHIDA TANEJIRO (JP)
SUZUKI KIYOFUMI (JP)
International Classes:
C10M169/06; B24B27/06; C10M105/14; C10M105/18; C10M107/34; C10M129/08; C10M129/16; C10M145/26; C10M173/00; C10N30/00; C10N30/18; C10N40/22; C10N40/32
Domestic Patent References:
| WO2009133612A1 | 2009-11-05 | |||
| WO1999051711A1 | 1999-10-14 |
Foreign References:
| JP2002053788A | 2002-02-19 | |||
| JP2003082334A | 2003-03-19 | |||
| JP2007031502A | 2007-02-08 |
Attorney, Agent or Firm:
MIGITA, Toshio et al. (JP)
Toshio Migita (JP)
Toshio Migita (JP)
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