Title:
WATER-SOLUBLE FLUX FOR SOLDER PASTE AND SOLDER PASTE
Document Type and Number:
WIPO Patent Application WO/2017/146098
Kind Code:
A1
Abstract:
The water-soluble flux for solder paste comprises: a polyglycerol/organic acid ester that is a surfactant that is solid at normal temperature; a thixotropic agent; and a solvent, wherein the thixotropic agent is benzylidene sorbitol or a benzylidene sorbitol derivative, and a surfactant that is liquid at normal temperature is also incorporated in an amount of 0.1-20.0 mass% in 100 mass% of the water-soluble flux. The HLB value of the polyglycerol/organic acid ester is preferably 10-19.
Inventors:
YASOSHIMA TSUKASA (JP)
UESUGI RYUJI (JP)
ISHIKAWA MASAYUKI (JP)
UESUGI RYUJI (JP)
ISHIKAWA MASAYUKI (JP)
Application Number:
PCT/JP2017/006597
Publication Date:
August 31, 2017
Filing Date:
February 22, 2017
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP (JP)
International Classes:
B23K35/363
Foreign References:
| JP2014024116A | 2014-02-06 | |||
| JP2014195825A | 2014-10-16 | |||
| JPH02284793A | 1990-11-22 | |||
| JPH1085985A | 1998-04-07 | |||
| JP2016043397A | 2016-04-04 |
Attorney, Agent or Firm:
SHIGA Masatake et al. (JP)
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