WATER-SOLUBLE WORKING FLUID FOR FIXED ABRASIVE GRAIN WIRE SAW

WIPO Patent Application WO/2012/115099

A1

Provided is a water-soluble working fluid for a fixed abrasive grain wire saw, which can suppress an increase in viscosity when contamination by chips occurs and suppress the occurrence of clogged piping or firm sticking in equipment caused by contamination by chips; the foregoing is achieved by containing (C) a carbonic acid, (D) a compound that is basic when dissolved in water and (E) water, having an electrical conductivity at 25°C of not lower than 300 μS/cm and not higher than 3000 μS/cm, having a pH at 25°C of not lower than 5 and not higher than 10, and having a viscosity of a pseudo-working liquid of less than 30 mPa•s at 25°C, where the pseudo working liquid is formed by adding 10 mass % of silicon grains having an average particle diameter of 1.5 μm and then stirring.

JP2575026

[Title of the Invention] Hydroxyphosphonocarboxylic acid, a method for producing the same, a scale inhibitor composed of the compound, a corrosion inhibitor or an antifouling agent

HAMAMOTO SHINJI (JP)
OHASHI YASUMASA (JP)
NUMATA YASUNORI (JP)
ISHIZUKA HIROMICHI (JP)
TAKAHASHI HIROAKI (JP)

PCT/JP2012/054115

August 30, 2012

February 21, 2012

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YUSHIRO CHEM IND (JP)
HAMAMOTO SHINJI (JP)
OHASHI YASUMASA (JP)
NUMATA YASUNORI (JP)
ISHIZUKA HIROMICHI (JP)
TAKAHASHI HIROAKI (JP)

C10M173/02; B24B27/06; B28D5/04; H01L21/304; C10M129/08; C10M129/26; C10M145/26; C10M145/28; C10M145/30; C10N20/00; C10N20/02; C10N30/00; C10N30/12; C10N40/22; C10N40/32

WO2011007590A1	2011-01-20
WO2012017947A1	2012-02-09

JP2003082335A	2003-03-19
JP2003082334A	2003-03-19
JP2001054850A	2001-02-27
JP2003082334A	2003-03-19

See also references of EP 2679661A4

YAMAMOTO, NORIAKI (JP)
Yamamoto 典輝 (JP)

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