Title:
WATERPROOF LIGHTING MODULE WHICH CHIP-ON-BOARD (COB), DIE-ON-BOARD (DOB) OR SIMILAR LED CLUSTERS INTEGRATED WITH OPTICAL STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2019/045658
Kind Code:
A3
Abstract:
The invention relates to an integrated lighting module (1) that is watertight, has enhanced heat conduction and is easily removable; the lighting module (1) is manufactured by assembly of a cover (10), which carries an optical structure (lens 40) and a connector (20), via screws or bolts (100) to a chassis and/or a printed circuit board (PCB) (90), and wherein COB, DOB and / or similar LED clusters (70) are also installed.
Inventors:
GUR ENGIN (RE)
Application Number:
PCT/TR2017/050488
Publication Date:
April 11, 2019
Filing Date:
October 10, 2017
Export Citation:
Assignee:
TTAF ELEKTRONIK SANAYI VE TICARET LTD SIRKETI (TR)
International Classes:
F21V15/01; F21V19/00; F21V23/00; F21V31/00; H05K1/18; F21V21/00; F21V23/06; F21Y115/10; H05K1/14
Domestic Patent References:
| WO2015101420A1 | 2015-07-09 |
Foreign References:
| US20150129910A1 | 2015-05-14 | |||
| US20130176732A1 | 2013-07-11 | |||
| US20140063814A1 | 2014-03-06 | |||
| DE102013114209A1 | 2015-06-18 | |||
| US20100099276A1 | 2010-04-22 |
Attorney, Agent or Firm:
INNOVASIA PATENT SANAYI VE TICARET LIMITED SIRKETI (TR)
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