WATERPROOF WIRED COMPONENT, AND DEVICE AND METHOD FOR PRODUCTION THEREOF

Title:

WATERPROOF WIRED COMPONENT, AND DEVICE AND METHOD FOR PRODUCTION THEREOF

Document Type and Number:

WIPO Patent Application WO/2017/067529

Kind Code:

A1

Abstract:

A waterproof wired component, and a device and a method for the production thereof are disclosed. The waterproof wired component comprises two lead wires (11) and a chip (12) soldered between the two lead wires, the lead wires and the chip both being enveloped and encapsulated by a same plastic element (13). The advantages of the invention are: uniform external appearance of the waterproof wired component; uniform chip positioning within the waterproof wired component; strong waterproofing capability; high degree of device automation; few human operators; low production cost; and, suitable for mass production.

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Inventors:

HUA GUOLIANG (CN)
WU JIEMAN (CN)
WANG LI (CN)
PENG HUAJUN (CN)

Application Number:

PCT/CN2016/111552

Publication Date:

April 27, 2017

Filing Date:

December 22, 2016

Export Citation:

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Assignee:

SHENZHEN MINJIE ELECTRONICS TECH CO LTD (CN)

International Classes:

F21S4/24; F21V31/00; H01L21/56; H01L23/28

Foreign References:

CN105390454A	2016-03-09
CN105508916A	2016-04-20
CN102374440A	2012-03-14
CN1238830A	1999-12-15

Attorney, Agent or Firm:

CHINA SCIENCE PATENT & TRADEMARK AGENT LTD. (CN)

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