Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
WAVELENGTH CONVERSION MATERIAL-CONTAINING SILICONE RESIN COMPOSITION, AND WAVELENGTH CONVERSION MATERIAL-CONTAINING SHEET
Document Type and Number:
WIPO Patent Application WO/2018/047757
Kind Code:
A1
Abstract:
Provided is a wavelength conversion material-containing composition that is capable of suppressing precipitation of the wavelength conversion material, and when applied as the wavelength conversion material of a semiconductor light-emitting device, is capable of suppressing a decline in the light output of the semiconductor light-emitting device and achieving high light output. A wavelength conversion material-containing silicone resin composition that includes a wavelength conversion material, a catalyst, and a silicone resin, wherein: the silicone resin content is 5 mass% or more; the silicone resin substantially comprises a condensate silicone resin, and includes a structural unit represented by formula (A3); the wavelength conversion material content is 20 mass% or more; the wavelength conversion material-containing silicone resin composition does not substantially include silica particles; and the wavelength conversion material-containing silicone resin composition is a liquid composition having a viscosity of 1,000-500,000 mPa⋅s at 25°C. (In the formula, R1 represents an alkyl group or an aryl group.)

Inventors:
MASUI KENTARO (JP)
DOI ATSUNORI (JP)
Application Number:
PCT/JP2017/031729
Publication Date:
March 15, 2018
Filing Date:
September 04, 2017
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
SUMITOMO CHEMICAL CO (JP)
International Classes:
C08L83/04; C08K3/22; C08K3/28; C08K3/30; G02B5/20; H01S5/0239; C08G77/14
Domestic Patent References:
WO2016017592A12016-02-04
Foreign References:
JP2015089898A2015-05-11
JP2014221880A2014-11-27
JP2014031436A2014-02-20
JP2010126596A2010-06-10
JP2009530437A2009-08-27
JP2009096947A2009-05-07
Other References:
See also references of EP 3511378A4
Attorney, Agent or Firm:
NAKAYAMA, Tohru et al. (JP)
Download PDF: