Title:
WAVELENGTH-VARIABLE LIGHT SOURCE
Document Type and Number:
WIPO Patent Application WO/2018/142499
Kind Code:
A1
Abstract:
The heat dissipation vias are formed from a through hole having an opening on the upper surface of the laser submount and a material packed into the through hole, the material having a heat conductivity higher than that of the laser submount. The wavelength-variable laser element is attached to the upper surface of the laser submount so that the back surface of the wavelength-variable laser element corresponding to the mounting surface on which the semiconductor optical amplifier is mounted is disposed above the region in which the heat dissipation vias are formed, and the back surface of the wavelength-variable laser element corresponding to the mounting surface on which the laser diode is mounted is disposed above the region in which the heat dissipation vias are not formed.
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Inventors:
UENO YUTO (JP)
MOCHIZUKI KEITA (JP)
HASEGAWA KIYOTOMO (JP)
SANO HAYATO (JP)
MOCHIZUKI KEITA (JP)
HASEGAWA KIYOTOMO (JP)
SANO HAYATO (JP)
Application Number:
PCT/JP2017/003564
Publication Date:
August 09, 2018
Filing Date:
February 01, 2017
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
H01S5/024
Foreign References:
| JP2013243206A | 2013-12-05 | |||
| JP2001144367A | 2001-05-25 | |||
| JP2011258758A | 2011-12-22 | |||
| JP2003124408A | 2003-04-25 | |||
| US9166130B2 | 2015-10-20 | |||
| US20120219025A1 | 2012-08-30 |
Attorney, Agent or Firm:
SOGA, Michiharu et al. (JP)
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