Title:
WAX MATERIAL CONTAINING AMIDE COMPOUND
Document Type and Number:
WIPO Patent Application WO/2019/093196
Kind Code:
A1
Abstract:
The present invention provides an amide compound which constitutes a wax component that is added to a resin to be molded, and which is able to be used over a wide processing temperature range because of the low melting point thereof, while improving the mold releasability and fluidity of the resin. This amide compound is effective for improvement of the dispersibility of a filler and for countermeasures against foreign substances, and is not thermally decomposed when a composition of the resin is molded at high temperatures, thereby preventing mold fouling and the like, while imparting the composition with excellent fluidity and mold releasability. The present invention also provides a wax material which contains this amide compound. An amide compound according to the present invention is a dehydration condensation product of a diamine having 2-21 carbon atoms, and a saturated aliphatic monocarboxylic acid having 23-50 carbon atoms and a polybasic acid having 2-14 carbon atoms. A wax material according to the present invention contains: an amide wax component that contains the above-described amide compound; or alternatively contains an amide wax component that contains at least one of the above-described amide compound and an amide compound which is a dehydration condensation product of a diamine having 2-21 carbon atoms, and a saturated aliphatic monocarboxylic acid having 12-22 carbon atoms and a polybasic acid having 2-14 carbon atoms, and an accompanying wax component other than the amide wax component.
Inventors:
KINUGAWA MASASHI (JP)
NAKATSUKA NOBUAKI (JP)
MATSUYAMA TAKANORI (JP)
TAKAGI MASAHIRO (JP)
NAKATSUKA NOBUAKI (JP)
MATSUYAMA TAKANORI (JP)
TAKAGI MASAHIRO (JP)
Application Number:
PCT/JP2018/040353
Publication Date:
May 16, 2019
Filing Date:
October 30, 2018
Export Citation:
Assignee:
KYOEISHA CHEMICAL CO LTD (JP)
International Classes:
C08G69/26; C07C233/00; C08K5/09; C08K5/20; C08L23/00; C08L77/06; C08L101/12
Domestic Patent References:
| WO2012086810A1 | 2012-06-28 | |||
| WO2011136354A1 | 2011-11-03 |
Foreign References:
| JPH02185579A | 1990-07-19 | |||
| JP2002128990A | 2002-05-09 | |||
| JP2009215290A | 2009-09-24 | |||
| JP2008173775A | 2008-07-31 | |||
| JPH02133947A | 1990-05-23 | |||
| JP2012201695A | 2012-10-22 | |||
| JPH04268372A | 1992-09-24 | |||
| JP2000248134A | 2000-09-12 | |||
| JPH05222240A | 1993-08-31 |
Attorney, Agent or Firm:
SHINKYU PARTNERS P.C. (JP)
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