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Patent Searching and Data


Title:
WEARABLE FLEXIBLE PRINTED CIRCUIT BOARD, MANUFACTURING METHOD THEREFOR AND WEARABLE SMART DEVICE USING SAME
Document Type and Number:
WIPO Patent Application WO/2017/034257
Kind Code:
A1
Abstract:
The present invention relates to a wearable flexible printed circuit board, a manufacturing method therefor and a wearable smart device using same, the wearable flexible printed circuit board having a conductive circuit pattern formed on a fiber web that is formed by the accumulation of fiber, thereby enabling a base substrate to have flexibility, restorability, waterproofness and air permeability, and thus the wearable flexible printed circuit board being capable of being applied to a future-oriented device. The wearable flexible printed circuit board comprises: a base substrate which is formed of a fiber-forming polymeric material and is formed of a fiber web formed by being integrated by means of spun fiber having a diameter of 3µm or less; and a conductive circuit pattern which is formed on the base substrate.

Inventors:
SEO IN YONG (KR)
Application Number:
PCT/KR2016/009233
Publication Date:
March 02, 2017
Filing Date:
August 22, 2016
Export Citation:
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Assignee:
AMOGREENTECH CO LTD (KR)
International Classes:
H05K1/03; B32B5/06; H05K3/12
Foreign References:
KR20130129105A2013-11-27
JP2015088537A2015-05-07
US5763058A1998-06-09
JP2015088536A2015-05-07
KR20130129104A2013-11-27
Attorney, Agent or Firm:
LEE, Jae Hwa (KR)
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