Title:
WELD-ASSEMBLY H-BEAM
Document Type and Number:
WIPO Patent Application WO/2020/183587
Kind Code:
A1
Abstract:
A weld-assembly H-beam is provided that takes advantage of the height of the cross-sectional design degree of freedom of the weld-assembly H-beam and has a high buckling strength, and with which it is possible to achieve high perpendicular support strength even with less steel. A weld-assembly H-beam wherein, given the length in the length direction L, the web height H, the flange width B, the flange thickness tf, and the web thickness tw, when β is defined as b/(H - tf), γ is defined as tf/B, and δ is defined as tw/tf, the weld-assembly H-beam satisfies the following expressions (1) – (9): H > 400 mm (1)
B > 400 mm (2)
H ≤ B (3)
L ≥ 10 × (H - tf) (4)
B/30 ≤ tf ≤ H/4 (5)
tf/3 ≤ tw ≤ min{tf, (1.5 × (B/H) - 1.0) × tf} (6)
1.0 ≤ β ≤ 1.6 (7)
1/30 ≤ γ (8)
δ ≥ (2.58 β – 1.12) + (17.2 β2 – 52.8 β + 18.0) × γ (9)
Inventors:
OKI KOJI (JP)
YOSHIDA TORU (JP)
YOSHIDA TORU (JP)
Application Number:
PCT/JP2019/009802
Publication Date:
September 17, 2020
Filing Date:
March 11, 2019
Export Citation:
Assignee:
JFE STEEL CORP (JP)
International Classes:
E04C3/32
Foreign References:
| JP2001279819A | 2001-10-10 | |||
| JP2009191487A | 2009-08-27 |
Other References:
"Product Size Table. Stainless Structure", JAPANESE SOC. OF STEEL CONSTRUCTION, 30 March 2010 (2010-03-30)
Attorney, Agent or Firm:
SUGIMURA Kenji (JP)
Download PDF:
Previous Patent: LIGHT EMITTING ELEMENT AND DISPLAY DEVICE USING SAME
Next Patent: METHOD FOR MANUFACTURING ELECTRONIC DEVICE
Next Patent: METHOD FOR MANUFACTURING ELECTRONIC DEVICE