Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
WELDED BELLOWS FOR SEMICONDUCTOR PRODUCTION DEVICES
Document Type and Number:
WIPO Patent Application WO/2012/147417
Kind Code:
A1
Abstract:
The present invention provides a welded bellows unlikely to be damaged by foreign matter, and having redundancy so as to be capable of supplementing by using the bellows plate on the non-treatment side in the unlikely event that the treatment-side bellows plate is damaged. A bellows-shaped welded bellows for semiconductor production devices that is obtained by causing a plurality of circular bellows plates that are curved in the radial direction to connect in an alternating manner toward the outer- and the inner-radial sides, the welding bellows being characterized in that: the circular bellows plates are provided with a treatment-side bellows plate and a non-treatment-side bellows plate; and there is an air layer interposed between the two bellows plates, the plate thickness of the treatment-side bellows plate is thick, and the plate thickness of the non-treatment-side bellows plate is thin.

Inventors:
TAKAHASHI HIDEKAZU (JP)
INOUE MASAHIKO (JP)
OCHIAI HIROYUKI (JP)
Application Number:
PCT/JP2012/056062
Publication Date:
November 01, 2012
Filing Date:
March 09, 2012
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
EAGLE IND CO LTD (JP)
EAGLEBURGMANN JAPAN CO LTD (JP)
TAKAHASHI HIDEKAZU (JP)
INOUE MASAHIKO (JP)
OCHIAI HIROYUKI (JP)
International Classes:
F16J3/04; F16J15/52
Foreign References:
JPS584848U1983-01-12
JPS4519670B1
JPH06281000A1994-10-07
JPS62251570A1987-11-02
JPH04282499A1992-10-07
JPH0972419A1997-03-18
Attorney, Agent or Firm:
SHIGENOBU Kazuo et al. (JP)
Shigenobu Kazuo (JP)
Download PDF:
Claims: