Title:
WELDED BELLOWS FOR SEMICONDUCTOR PRODUCTION DEVICES
Document Type and Number:
WIPO Patent Application WO/2012/147417
Kind Code:
A1
Abstract:
The present invention provides a welded bellows unlikely to be damaged by foreign matter, and having redundancy so as to be capable of supplementing by using the bellows plate on the non-treatment side in the unlikely event that the treatment-side bellows plate is damaged. A bellows-shaped welded bellows for semiconductor production devices that is obtained by causing a plurality of circular bellows plates that are curved in the radial direction to connect in an alternating manner toward the outer- and the inner-radial sides, the welding bellows being characterized in that: the circular bellows plates are provided with a treatment-side bellows plate and a non-treatment-side bellows plate; and there is an air layer interposed between the two bellows plates, the plate thickness of the treatment-side bellows plate is thick, and the plate thickness of the non-treatment-side bellows plate is thin.
Inventors:
TAKAHASHI HIDEKAZU (JP)
INOUE MASAHIKO (JP)
OCHIAI HIROYUKI (JP)
INOUE MASAHIKO (JP)
OCHIAI HIROYUKI (JP)
Application Number:
PCT/JP2012/056062
Publication Date:
November 01, 2012
Filing Date:
March 09, 2012
Export Citation:
Assignee:
EAGLE IND CO LTD (JP)
EAGLEBURGMANN JAPAN CO LTD (JP)
TAKAHASHI HIDEKAZU (JP)
INOUE MASAHIKO (JP)
OCHIAI HIROYUKI (JP)
EAGLEBURGMANN JAPAN CO LTD (JP)
TAKAHASHI HIDEKAZU (JP)
INOUE MASAHIKO (JP)
OCHIAI HIROYUKI (JP)
International Classes:
F16J3/04; F16J15/52
Foreign References:
JPS584848U | 1983-01-12 | |||
JPS4519670B1 | ||||
JPH06281000A | 1994-10-07 | |||
JPS62251570A | 1987-11-02 | |||
JPH04282499A | 1992-10-07 | |||
JPH0972419A | 1997-03-18 |
Attorney, Agent or Firm:
SHIGENOBU Kazuo et al. (JP)
Shigenobu Kazuo (JP)
Shigenobu Kazuo (JP)
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