Title:
WELDING METHOD OF SUBSTRATE AND MEMBRANE OF MEMBRANE MOBILE POLYMER MICROFLUIDIC CHIP
Document Type and Number:
WIPO Patent Application WO/2013/023449
Kind Code:
A1
Abstract:
Provided is a welding method of a substrate and a membrane of a membrane mobile polymer microfluidic chip, which is related to the technical field of manufacturing a membrane mobile polymer microfluidic chip. The method comprises steps of: before welding, fixing the substrate, and covering the membrane to a surface of the substrate; applying a pressure to press the membrane onto the surface of the substrate, and during welding, laser irradiating a welding region of the substrate through the membrane, so that the substrate is welded to the membrane after the welding region is heated and melted. By means of the method, the welding of the membrane and the substrate of the membrane mobile polymer microfluidic chip is implemented, the welding is firm, and the welded surface is smooth and even.
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Inventors:
YANG QI (CN)
Application Number:
PCT/CN2012/071781
Publication Date:
February 21, 2013
Filing Date:
February 29, 2012
Export Citation:
Assignee:
BEIJING BOHUI INNOVATION TECHNOLOGY CO LTD (CN)
YANG QI (CN)
YANG QI (CN)
International Classes:
B23K26/20; B23K26/42; B29C65/16
Foreign References:
| CN101026101A | 2007-08-29 | |||
| US5094709A | 1992-03-10 | |||
| US20020088777A1 | 2002-07-11 | |||
| US20070125489A1 | 2007-06-07 | |||
| CN1496778A | 2004-05-19 | |||
| CN00101924A | 2000-01-28 |
Other References:
See also references of EP 2745977A4
Attorney, Agent or Firm:
CN-KNOWHOW INTELLECTUAL PROPERTY AGENT LIMITED (CN)
北京路浩知识产权代理有限公司 (CN)
北京路浩知识产权代理有限公司 (CN)
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Claims: