Title:
WET-ETCHING COMPOSITION FOR SEMICONDUCTORS EXCELLENT IN WETTABILITY
Document Type and Number:
WIPO Patent Application WO/1994/018696
Kind Code:
A1
Abstract:
A wet-etching composition for semiconductors which is produced by adding a surfactant composed of an alkylsulfonic acid and an omega-hydrofluoro-alkylcarboxylic acid to a buffered hydrofluoric acid comprising hydrogen fluoride, ammonium fluoride and water.
Inventors:
ISHII MASAO (JP)
HOSOMI TOMOHIRO (JP)
MARUYAMA SHIGERU (JP)
ITANO MITSUSHI (JP)
HOSOMI TOMOHIRO (JP)
MARUYAMA SHIGERU (JP)
ITANO MITSUSHI (JP)
Application Number:
PCT/JP1994/000147
Publication Date:
August 18, 1994
Filing Date:
February 02, 1994
Export Citation:
Assignee:
DAIKIN IND LTD (JP)
ISHII MASAO (JP)
HOSOMI TOMOHIRO (JP)
MARUYAMA SHIGERU (JP)
ITANO MITSUSHI (JP)
ISHII MASAO (JP)
HOSOMI TOMOHIRO (JP)
MARUYAMA SHIGERU (JP)
ITANO MITSUSHI (JP)
International Classes:
C09K13/10; H01L21/306; H01L21/311; (IPC1-7): H01L21/306; H01L21/308
Foreign References:
| JPS6039176A | 1985-02-28 | |||
| JPH0353083A | 1991-03-07 | |||
| JPH03179737A | 1991-08-05 | |||
| JPS63283028A | 1988-11-18 |
Other References:
See also references of EP 0691676A4
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