Title:
WET ETCHING CONTROL SYSTEM, WET ETCHING MACHINE AND WET ETCHING CONTROL METHOD
Document Type and Number:
WIPO Patent Application WO/2022/052550
Kind Code:
A1
Abstract:
Provided are a wet etching control system, a wet etching machine and a wet etching control method, which relate to a technique for manufacturing semiconductor integrated circuits. The wet etching control system comprises: a liquid level measurement unit for measuring a liquid level of a leaked liquid in a leaked liquid collection tank; an etchant spraying unit; a cleaning agent spraying unit; and a control unit for controlling, when the liquid level of the leaked liquid is greater than a first pre-set value, the etchant spraying unit to stop spraying an etchant onto a wafer surface and controlling the cleaning agent spraying unit to spray a cleaning agent onto the wafer surface. The wet etching machine comprises the wet etching control system. The wet etching control method comprises: measuring the liquid level of a leaked liquid in a leaked liquid collection tank; and when the liquid level of the leaked liquid is greater than a first pre-set value, controlling the spraying of an etchant onto a wafer to stop and controlling a cleaning agent to spray onto the wafer. By means of the wet etching control system, the wet etching machine and the wet etching control method in the present application, the acceptance rate of finished products during a wafer etching process can be increased.
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Inventors:
CHEN HSIN-HUNG (CN)
HUANG YEN-TENG (CN)
HUANG YEN-TENG (CN)
Application Number:
PCT/CN2021/100583
Publication Date:
March 17, 2022
Filing Date:
June 17, 2021
Export Citation:
Assignee:
CHANGXIN MEMORY TECH INC (CN)
International Classes:
H01L21/67
Foreign References:
| CN106356316A | 2017-01-25 | |||
| CN209487474U | 2019-10-11 | |||
| CN208833444U | 2019-05-07 | |||
| CN110534452A | 2019-12-03 |
Attorney, Agent or Firm:
LEADER PATENT & TRADEMARK FIRM (CN)
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