Title:
WET ETCHING METHOD AND ETCHING SOLUTION
Document Type and Number:
WIPO Patent Application WO/2017/013988
Kind Code:
A1
Abstract:
A wet etching method for etching a metal-containing film on a substrate using an etching solution, wherein the wet etching method is characterized in that the etching solution is an organic solvent solution of a β-diketone in which a trifluoromethyl group and a carbonyl group are bonded, and the metal-containing film contains a metal element capable of forming a complex with the β-diketone.
Inventors:
YAO AKIFUMI (JP)
YAMAUCHI KUNIHIRO (JP)
FUJIWARA MASAKI (JP)
MIYAZAKI TATSUO (JP)
YAMAUCHI KUNIHIRO (JP)
FUJIWARA MASAKI (JP)
MIYAZAKI TATSUO (JP)
Application Number:
PCT/JP2016/068456
Publication Date:
January 26, 2017
Filing Date:
June 22, 2016
Export Citation:
Assignee:
CENTRAL GLASS CO LTD (JP)
International Classes:
H01L21/308; C23F1/10
Domestic Patent References:
| WO2014197808A1 | 2014-12-11 |
Foreign References:
| JP2014029939A | 2014-02-13 | |||
| JPH09304947A | 1997-11-28 | |||
| JPS5992916A | 1984-05-29 |
Attorney, Agent or Firm:
KOBAYASHI, Hiromichi et al. (JP)
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