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Patent Searching and Data


Title:
WET WIPE CHEMICAL SOLUTION AND WET WIPE
Document Type and Number:
WIPO Patent Application WO/2014/050128
Kind Code:
A1
Abstract:
A chemical solution for wet wipe and a wet wipe that are paraben-free and allow ease of extraction thereof even with higher water content than conventional products. A paraben-free chemical solution for wet wipe is provided in which the product of the chemical solution film thickness measured by a measurement method specified below and the chemical solution surface tension is at least 810 um.mN/m. For measuring the chemical solution film thickness, first, 0.03 ml of the chemical solution was dropped on a glass slide and another glass slide of the same size was gently placed thereon. Then, allow the glass slides to stand for 30 seconds, and measure the liquid film thickness of the chemical solution interposed between the glass slides by magnified observation with a microscope from a position immediately lateral to the glass slides.

Inventors:
UEDA TAKAHIRO (JP)
KONDOH NAMI (JP)
BANDOH TAKESHI (JP)
Application Number:
PCT/JP2013/005749
Publication Date:
April 03, 2014
Filing Date:
September 26, 2013
Export Citation:
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Assignee:
UNICHARM CORP (JP)
International Classes:
A47K7/00
Foreign References:
JP2004529148A2004-09-24
JP2004059486A2004-02-26
JP2005296240A2005-10-27
JP2005255213A2005-09-22
Other References:
See also references of EP 2900116A4
None
Attorney, Agent or Firm:
SHOBAYASHI, Masayuki et al. (1-7-12 Marunouchi, Chiyoda-k, Tokyo 05, JP)
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