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Patent Searching and Data


Title:
WHETSTONE, MANUFACTURING METHOD FOR SAME, AND METHOD FOR POLISHING POLYCRYSTALLINE SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2018/150918
Kind Code:
A1
Abstract:
A whetstone 10 has a groove 14 formed on a surface 12a of a disc 12 with a Vickers hardness of 15 GPa or greater, a flatness of 5 μm or less, and a surface roughness Ra of 0.1 nm to 500 nm. A polycrystalline substrate with a Vickers hardness lower than that of the whetstone 10 surface is polished with this whetstone 10. By doing so, a polycrystalline substrate with a surface roughness Ra in the sub-nanometer order can be obtained after polishing.

Inventors:
WATANABE KEIICHIRO (JP)
TSUJI HIROYUKI (JP)
TAKAHASHI TOMONORI (JP)
NAGAE TOMOKI (JP)
Application Number:
JP2018/003695
Publication Date:
August 23, 2018
Filing Date:
February 02, 2018
Export Citation:
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Assignee:
NGK INSULATORS LTD (Postcode4678530, JP)
International Classes:
B24D7/00; B24B7/22; B24D3/00
Foreign References:
JP2003117833A2003-04-23
JP2012166326A2012-09-06
Attorney, Agent or Firm:
ITEC INTERNATIONAL PATENT FIRM (Postcode4600003, JP)
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