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Title:
WHITE CURABLE COMPOSITION FOR OPTICAL SEMICONDUCTOR DEVICE, PROCESS FOR PRODUCING WHITE CURABLE COMPOSITION FOR OPTICAL SEMICONDUCTOR DEVICE, MOLDED OBJECT FOR OPTICAL SEMICONDUCTOR DEVICE, AND OPTICAL SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2016/010062
Kind Code:
A1
Abstract:
Provided is a white curable composition for optical semiconductor devices that is able to come to have heightened compressive strength and improved mold releasability and that, when used to produce an optical semiconductor device, can render the device less apt to decrease in luminance even when used with voltage application thereto under severe conditions. The white curable composition for optical semiconductor devices according to the present invention comprises an epoxy compound, an acid anhydride hardener, a white pigment, a filler which is not a white pigment, and a hardening accelerator, the acid anhydride hardener comprising an acid anhydride hardener that has one or more carbon-carbon single bonds as the only carbon-carbon bond(s). When the white curable composition is examined by differential scanning calorimetry, the exotherm during the period from initiation of the hardening to the completion is 20-80 J/g and the endotherm during the period from initiation of the melting to the completion is 0.1-15 J/g.

Inventors:
YASUI HIDEFUMI (JP)
NAKAGAWA HIROAKI (JP)
KAGE SHUUJI (JP)
HIGUCHI ISAO (JP)
FUKUDA TAKASHI (JP)
MIKAMI HARUKA (JP)
Application Number:
PCT/JP2015/070222
Publication Date:
January 21, 2016
Filing Date:
July 15, 2015
Export Citation:
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Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
C08G59/42; C08J3/20; C08K3/22; C08K3/36; C08L63/00; H01L23/29; H01L23/31; H01L33/60
Foreign References:
JP2009242772A2009-10-22
JP2009097005A2009-05-07
JP2012172012A2012-09-10
JP2012041403A2012-03-01
JP2003277479A2003-10-02
JP5602923B12014-10-08
Attorney, Agent or Firm:
MIYAZAKI & METSUGI (JP)
Patent business corporation Miyazaki and table-of-contents patent firm (JP)
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