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Patent Searching and Data


Title:
WINDING COMPONENT
Document Type and Number:
WIPO Patent Application WO/2007/086412
Kind Code:
A1
Abstract:
[PROBLEMS] To achieve a highly reliable structure essentially by solving the problem of disconnection incident to application of external force to a terminal and the problem of disconnection due to solder dip heat without causing degradation in terminal strength, cost increase or thinning of a wire. [MEANS FOR SOLVING PROBLEMS] In a winding component where a terminal (12) is projecting from a bobbin (14) equipped with a winding portion and a winding terminal is connected with the terminal, a resin protrusion (40) is formed integrally with the bobbin at the root of the terminal. The resin protrusion has such a shape that a portion of its periphery is notched to allow the side face of the terminal to project partially, a wire wound around the resin protrusion tightly a plurality of times is brought into contact with the terminal and connected by solder dip.

Inventors:
HIRONAKA KIYOSHI (JP)
AKIYAMA HIDEYUKI (JP)
HIROHASHI TORU (JP)
YAMADA KATSUO (JP)
FUJII AKIHIRO (JP)
Application Number:
PCT/JP2007/051066
Publication Date:
August 02, 2007
Filing Date:
January 24, 2007
Export Citation:
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Assignee:
FDK CORP (JP)
HIRONAKA KIYOSHI (JP)
AKIYAMA HIDEYUKI (JP)
HIROHASHI TORU (JP)
YAMADA KATSUO (JP)
FUJII AKIHIRO (JP)
International Classes:
H01F38/08; H01F27/28
Foreign References:
JPS6260019U1987-04-14
JPH0476018U1992-07-02
JPS6219721U1987-02-05
JPS6249218U1987-03-26
Attorney, Agent or Firm:
ISSHIKI & CO. (12-7 Shinbashi 2-chom, Minato-ku Tokyo, JP)
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