Title:
WINDOW THERMAL-INSULATION FILM, WINDOW THERMAL-INSULATION GLASS, AND WINDOW
Document Type and Number:
WIPO Patent Application WO/2016/017658
Kind Code:
A1
Abstract:
Provided is a window thermal-insulation film that is disposed on the inside of a window. The window thermal-insulation film includes at least a support body and a fibrous-conductive-particle-containing layer that is disposed upon the support body. The fibrous-conductive-particle-containing layer contains fibrous conductive particles and is disposed upon a surface of the support body that is on the opposite side from a window-side surface thereof. The resistivity of the fibrous-conductive-particle-containing layer is 1000 Ω/□ or more, and the window thermal-insulation film has excellent thermal insulation properties and excellent electromagnetic wave transmission properties. Also provided are a window thermal-insulation glass, and a window.
Inventors:
KIYOTO NAOHARU (JP)
OKAZAKI KENTARO (JP)
YASUDA HIDEKI (JP)
OKAZAKI KENTARO (JP)
YASUDA HIDEKI (JP)
Application Number:
PCT/JP2015/071428
Publication Date:
February 04, 2016
Filing Date:
July 29, 2015
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
G02B5/26; B32B17/10; B32B27/18; E06B5/00
Domestic Patent References:
| WO2014061279A1 | 2014-04-24 |
Foreign References:
| JP2012252172A | 2012-12-20 | |||
| JP2004284839A | 2004-10-14 | |||
| JP2002012451A | 2002-01-15 | |||
| JP2013010341A | 2013-01-17 |
Attorney, Agent or Firm:
SIKs & Co. (JP)
Patent business corporation patent firm Sykes (JP)
Patent business corporation patent firm Sykes (JP)
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