Title:
WIPING DEVICE, AND LAMINATE FABRICATING DEVICE
Document Type and Number:
WIPO Patent Application WO/2015/166363
Kind Code:
A1
Abstract:
An objective of the present invention is to prevent adverse effects when attaching a film by wiping away an adhered seal material (30a). A wiping device (200) or a laminate fabricating device (100) equipped with such a wiping device (200), said wiping device (200) being equipped with: a stage (230) that supports a sheet-shaped member (220); a wiping means (210) that wipes an adhered substance (30a) that has been adhered to the outer periphery of the sheet-shaped member (220); a wiping cloth (241) that is attachably/detachably provided to the wiping means (210); and a solvent (261) that is adhered to the wiping cloth (241). The wiping means (210) attaches the wiping cloth (241), adheres the solvent (261) to the wiping cloth (241), and wipes away the adhered substance (30a).
Inventors:
OHNO MASAKATSU
KUMAKURA KAYO (JP)
IDOJIRI SATORU
HIRAKATA YOSHIHARU
YOKOYAMA KOHEI
KUMAKURA KAYO (JP)
IDOJIRI SATORU
HIRAKATA YOSHIHARU
YOKOYAMA KOHEI
Application Number:
PCT/IB2015/052660
Publication Date:
November 05, 2015
Filing Date:
April 13, 2015
Export Citation:
Assignee:
SEMICONDUCTOR ENERGY LAB (JP)
International Classes:
B08B1/00; B08B11/00; H01L21/02; H01L21/304; H01L27/12
Domestic Patent References:
| WO2011078446A1 | 2011-06-30 |
Foreign References:
| JP2003071391A | 2003-03-11 | |||
| JPH11188677A | 1999-07-13 | |||
| JP2003053281A | 2003-02-25 | |||
| JP2000237699A | 2000-09-05 | |||
| JP2003174153A | 2003-06-20 |
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