Title:
WIRE-BONDED SEMICONDUCTOR COMPONENT WITH REINFORCED INNER CONNECTION METALLIZATION
Document Type and Number:
WIPO Patent Application WO2005057654
Kind Code:
A3
Abstract:
A semiconductor component comprising a semiconductor chip (2) made of a doped silicon substrate, which chip is doped into a semiconductor device and structured, and comprises an inner connection metallization (7) in a contact window, and said inner connection metallization of said semiconductor chip is connected to the respective outer connection metallization by a wire bond connection (9), characterized in that the inner connection metallization comprises a reinforcing system (8) having an open grid structure on the doped silicon substrate.
More Like This:
| JP2013098574 | MULTI-CHIP MODULE FOR DOWN-HOLE DEVICE |
| JP3451301 | MANUFACTURE OF FILM DEVICE |
Inventors:
BEHRENS JOERG (DE)
Application Number:
PCT/IB2004/052628
Publication Date:
August 04, 2005
Filing Date:
December 01, 2004
Export Citation:
Assignee:
PHILIPS INTELLECTUAL PROPERTY (DE)
KONINKL PHILIPS ELECTRONICS NV (NL)
BEHRENS JOERG (DE)
KONINKL PHILIPS ELECTRONICS NV (NL)
BEHRENS JOERG (DE)
International Classes:
H01L21/60; H01L23/485; (IPC1-7): H01L23/485; H01L21/60
Foreign References:
| US20030178644A1 | 2003-09-25 | |||
| US20020187634A1 | 2002-12-12 | |||
| EP0875934A2 | 1998-11-04 |
Download PDF: