Title:
WIRE BONDING DEVICE, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2018/168888
Kind Code:
A1
Abstract:
A wire bonding device 1 is provided with: a first tensioner 70 which, on a wire supply side of a bonding tool 40, forms a first gas flow 70b for tensioning a wire 42 on the wire supply side; a second tensioner 72 which, between the first tensioner 70 and a pressing portion 41a of the bonding tool 40, forms a second gas flow 72b for tensioning the wire 42 on the wire supply side; and a control unit 80 which controls the first tensioner 70 and the second tensioner 72. The control unit 80 implements control, in a predetermined period after a first bonding step for bonding the wire 42 to a first bonding point 112, to turn off, or make smaller than in the first bonding step, at least the second gas flow 72b of the second tensioner 72 among the first and second tensioners 70, 72. In this way, good wire bonding is performed while satisfying the demand for maintainability and size reduction.
Inventors:
TEI SHINSUKE (JP)
Application Number:
PCT/JP2018/009832
Publication Date:
September 20, 2018
Filing Date:
March 14, 2018
Export Citation:
Assignee:
SHINKAWA KK (JP)
International Classes:
H01L21/60
Foreign References:
| JPH04184947A | 1992-07-01 | |||
| JP2013084848A | 2013-05-09 | |||
| JPH11168119A | 1999-06-22 |
Attorney, Agent or Firm:
INABA, Yoshiyuki et al. (JP)
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