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Title:
WIRE BONDING DEVICE
Document Type and Number:
WIPO Patent Application WO/2013/024612
Kind Code:
A1
Abstract:
This invention is provided with: a capillary (31) for bonding a wire to each electrode; a horizontal plate (21) provided with a through-hole (22) with respect to which the tip of the capillary (31) is inserted/removed; a first anti-oxidation gas channel (12) for blowing out an anti-oxidation gas toward the center (22c) of the through-hole (22) along the upper surface (21a) of the horizontal plate (21); and a second anti-oxidation gas channel (13) for blowing out the anti-oxidation gas toward the center (22c) of the through-hole (22) along the upper surface (21a) of the horizontal plate (21) from a direction that intersects the first anti-oxidation gas channel (12). The region of the horizontal plate (21) in which the anti-oxidation gas channels (12, 13) are not arranged is open so that the gas on the upper surface (21a) of the horizontal plate (21) can flow out to the outside of the edges (23-25) of the horizontal plate (21). Oxidation of the surface of the free air ball in the wire bonding device is thereby suppressed.

Inventors:
KUNIYOSHI KATSUTOSHI (JP)
KIUCHI HAYATO (JP)
Application Number:
PCT/JP2012/063844
Publication Date:
February 21, 2013
Filing Date:
May 30, 2012
Export Citation:
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Assignee:
SHINKAWA KK (JP)
KUNIYOSHI KATSUTOSHI (JP)
KIUCHI HAYATO (JP)
International Classes:
H01L21/60
Domestic Patent References:
WO2009152066A22009-12-17
Foreign References:
JPH08264583A1996-10-11
JPH03253045A1991-11-12
Attorney, Agent or Firm:
YKI Patent Attorneys (JP)
Patent business corporation YKI international patent firm (JP)
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