Title:
WIRE BONDING DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/147164
Kind Code:
A1
Abstract:
This wire bonding device has: a piezoelectric element (16); an ultrasonic horn (14); a capillary (15), which presses a wire (21) to an electrode by being attached to a leading end of the ultrasonic horn (14),and which applies ultrasonic vibration to the wire (21); an arithmetic unit (60) that calculates, on the basis of the resonance frequency fr of the ultrasonic horn (14), power Powerreq or a bond load Freq to be supplied to the piezoelectric element (16); and a control unit (50) that adjusts, on the basis of the power Powerreq or the bond load Freq calculated by the arithmetic unit, power Power or a bond load F to be supplied to the piezoelectric element (16).
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Inventors:
NAGANO KAZUAKI (JP)
Application Number:
PCT/JP2018/003450
Publication Date:
August 16, 2018
Filing Date:
February 01, 2018
Export Citation:
Assignee:
SHINKAWA KK (JP)
International Classes:
H01L21/60; B06B1/06; H01L21/607
Domestic Patent References:
| WO2014077232A1 | 2014-05-22 |
Foreign References:
| JPH06204300A | 1994-07-22 | |||
| JP2001077156A | 2001-03-23 |
Attorney, Agent or Firm:
YKI PATENT ATTORNEYS (JP)
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