WIRE BONDING METHOD, ELECTRONIC COMPONENT, LIGHT EMITTING ELECTRONIC COMPONENT, COMPOSITE LIGHT EMITTING ELECTORNIC COMPONENT, AND LIGHT EMITTING DEVICE

WIPO Patent Application WO/2010/073844

A1

A LED light emitting electronic component is comprised of a stainless-steel lead frame, a die bonding frame (65), and a wire bonding frame (64).  The die bonding frame (65) is comprised of a horizontal portion (63) and a die bonding portion (67) which extends downwardly from the horizontal portion (63) and is shaped into a recessed shape or a cup shape by spinning.  The wire bonding frame (64) is positioned at the same height as the horizontal portion (63), and is electrically separated from the die bonding portion (67) by a gap (68).  The bonding area of the wire bonding frame (64) is disposed at a height greater than that of the light emitting surface of a LED chip (62).  An underlying silver layer (69) obtained by burning a composite silver nanoparticle layer is provided on the upper surface of the wire bonding frame (64).  A wire bonding (70) composed of a gold wire is provided between the upper surface electrode of the LED chip (62) and the underlying silver layer (69).

JP4547652	Self-aligning pressing device
JPS57106057	BUMP STRUCTURE OF IC

ISHIKURA TAKURO (JP)
MATSUDA KAORU (JP)
KOMATSU TERUO (JP)
WAKURA SHINJI (JP)

PCT/JP2009/069276

July 01, 2010

November 12, 2009

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APPLIED NANOPARTICLE LAB CORP (JP)
ISHIKURA TAKURO (JP)
MATSUDA KAORU (JP)
ASAHI ELECTRONICS LAB CO LTD (JP)
KOMATSU TERUO (JP)
WAKURA SHINJI (JP)

H01L21/60; B22F1/00; B22F1/02

JP2007165507A	2007-06-28
JP2006245389A	2006-09-14
JP2005158785A	2005-06-16

MIKI HISAMI (JP)
Hisami Miki (JP)

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