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Title:
WIRE CLAMP DEVICE CALIBRATION METHOD AND WIRE BONDING DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/038135
Kind Code:
A1
Abstract:
This wire clamp device calibration method comprises: a step for driving a driving piezoelectric element (80) by applying a predetermined frequency that causes a pair of arm parts (72a, 72b) to vibrate in an opening/closing direction; a step for detecting whether or not end parts (73a, 73b) of the pair of arm parts (72a, 72b) collide with each other on the basis of an output current outputted from the driving piezoelectric element (80) when the pair of arm parts (72a, 72b) are vibrating in the opening/closing direction; a step for calculating, on the basis of the detection result, reference voltages (VR1, VR2) in a state where the pair of arm parts (72a, 72b) are closed; and a step for performing calibration of a drive voltage to be applied to the driving piezoelectric element (80) on the basis of the reference voltages (VR1, VR2). Accordingly, accuracy improvement and stabilization in an opening/closing operation of the wire clamp device can be achieved.

Inventors:
UCHIDA YOHEI (JP)
TAIRA NAOYA (JP)
Application Number:
PCT/JP2017/030051
Publication Date:
March 01, 2018
Filing Date:
August 23, 2017
Export Citation:
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Assignee:
SHINKAWA KK (JP)
International Classes:
H01L21/60; H01L41/083; H01L41/09
Domestic Patent References:
WO2015122410A12015-08-20
Foreign References:
JPH06260523A1994-09-16
JPH06260524A1994-09-16
JPH05259213A1993-10-08
JPS63111634A1988-05-16
JPH09162228A1997-06-20
Attorney, Agent or Firm:
INABA, Yoshiyuki et al. (JP)
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