Title:
WIRE COATED WITH SOLID MICROPARTICLES, AND METHOD FOR PRODUCING WIRE COATED WITH SOLID MICROPARTICLES
Document Type and Number:
WIPO Patent Application WO/2013/039097
Kind Code:
A1
Abstract:
The purpose of this invention is to provide a durable, high-performance wire coated with solid microparticles, the wire allowing solid microparticles such as diamond particles to be affixed to the wire in a stable manner; and to provide a method for producing the wire coated with solid microparticles. In order to achieve this objective, there is provided a wire coated with solid microparticles or the like in which the solid microparticles are affixed to the outer peripheral surface of the wire, wherein the wire or the like coated with solid microparticles is characterized that the surface of the wire is provided with: a nickel electroplating layer containing solid microparticles, the microparticles being dispersed, surface-modified solid microparticles with an inorganic coating layer; and a nickel plating overcoat layer on the surface of the nickel electroplating layer containing solid microparticles.
Inventors:
KISHI KAZUYUKI (JP)
MITSUI HIDEO (JP)
MITSUI HIDEO (JP)
Application Number:
PCT/JP2012/073304
Publication Date:
March 21, 2013
Filing Date:
September 12, 2012
Export Citation:
Assignee:
FACILITY CO LTD (JP)
KISHI KAZUYUKI (JP)
MITSUI HIDEO (JP)
KISHI KAZUYUKI (JP)
MITSUI HIDEO (JP)
International Classes:
B24D11/00; B24B27/06; B24D3/00
Domestic Patent References:
| WO2011042931A1 | 2011-04-14 |
Foreign References:
| JP2003340729A | 2003-12-02 | |||
| JP2010201542A | 2010-09-16 | |||
| JP2011121161A | 2011-06-23 | |||
| JP2006181698A | 2006-07-13 |
Attorney, Agent or Firm:
YOSHIMURA, KATSUHIRO (JP)
Katsuhiro Yoshimura (JP)
Katsuhiro Yoshimura (JP)
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Claims:
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