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Patent Searching and Data


Title:
WIRE CONNECTION STRUCTURE FOR METAL-CORE PRINTED CIRCUIT BOARD, METAL-CORE PRINTED CIRCUIT BOARD, AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2017/209168
Kind Code:
A1
Abstract:
The present invention ensures a reduction in size and thickness of a metal-core printed circuit board and surrounding structure thereof. A wire connection structure of a metal-core printed circuit board (1) in which an insulating layer (3) is formed on the surface of an aluminum plate, and an electroconductive pattern (4) is formed on the surface of the insulating layer (3), wherein the wire connection structure is provided with: an insertion hole (7) formed passing through the insulating layer (3) from the side surface of the aluminum plate (2) and extending across the surface of the metal-core printed circuit board (1); and a wire (9) inserted into the insertion hole (7) and connected to the electroconductive pattern. The wire (9) has a conductor (9a) that is coated with an insulating material (9b), and the connection parts (11) of the wire (9) and the electroconductive pattern, and the wire outlet (15) of the insertion hole (7), are covered with silicone rubber (12). The end of an electroconductive tube (8) is inserted into the insertion hole (7) formed in the side surface of the aluminum plate (2), and the wire (9) is inserted inside the electroconductive tube (8).

Inventors:
YAMANAKA YUSUKE (JP)
Application Number:
PCT/JP2017/020201
Publication Date:
December 07, 2017
Filing Date:
May 31, 2017
Export Citation:
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Assignee:
KASAI ARCH DESIGN CONSULTANTS CO LTD (JP)
International Classes:
H01R12/53; H05K1/05; H05K1/11; H05K3/44
Foreign References:
JP2008198964A2008-08-28
JP2014069218A2014-04-21
JPH0297088A1990-04-09
JP2006019542A2006-01-19
Attorney, Agent or Firm:
ASHIKITA Tomoharu (JP)
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