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Patent Searching and Data


Title:
WIRE CURING DIAMETER ADJUSTING MECHANISM IN BINDING MACHINE
Document Type and Number:
WIPO Patent Application WO/2007/097342
Kind Code:
A1
Abstract:
In a binding machine, a mounting angle of a guide member (8) for forming a wire (3) into a loop is made adjustable to reduce worked precision require for the member. Two guide pins (11, 12) erected from a guide plate (7) projecting form the binding machine body are respectively housed in guide pin fitting holes (13, 14) formed in the guide member (8), and the guide member (8) is fixed by screwing fixing screws (23a, 23b) to the guide pins (11, 12). One guide pin (12) is loosely fitted into its corresponding guide pin fitting hole (14), and the tip ends of embedded screws (22a, 22b) screwed into screw holes (20, 21) penetrating the inner side surface of the guide pin fitting hole (14) and the outer side surface of the guide member (8) are brought into contact with the peripheral surface of the guide pin (12) to adjust an angle of the guide member (8) with respect to the guide plate (7).

Inventors:
KUSAKARI, Ichiro (())
草刈 一郎 (())
NAGAOKA, Takahiro (())
長岡 孝博 (())
Application Number:
JP2007/053105
Publication Date:
August 30, 2007
Filing Date:
February 20, 2007
Export Citation:
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Assignee:
MAX CO., LTD. (6-6 Nihonbashi hakozaki-cho, Chuo-ku Tokyo, 02, 1038502, JP)
マックス株式会社 (〒02 東京都中央区日本橋箱崎町6番6号 Tokyo, 1038502, JP)
KUSAKARI, Ichiro (())
草刈 一郎 (())
NAGAOKA, Takahiro (())
International Classes:
B65B13/18; B21F15/06; B65B27/10; E04G21/12
Attorney, Agent or Firm:
OGURI, Shohei et al. (Eikoh Patent Office, 7-13 Nishi-Shimbashi 1-chome, Minato-k, Tokyo 03, 1050003, JP)
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