Title:
WIRE DISCHARGE MACHINING APPARATUS, METHOD FOR PRODUCING THIN PLATE USING SAID APPARATUS, AND METHOD FOR PRODUCING SEMICONDUCTOR WAFER USING SAID APPARATUS
Document Type and Number:
WIPO Patent Application WO/2014/188754
Kind Code:
A1
Abstract:
To perform high-precision cut-machining by stable power supply from a machining power source, the present invention is a wire discharge machining apparatus for winding a wire (3) multiple times between main guide rollers (1a) to (1d), and performing a plurality of cut-machining operations simultaneously, wherein: the work of fitting a plurality of wires (3) on the power supply elements of the wires is reduced; uniform power is supplied to cut wire parts (CL); stable machining is designed; the plurality of power supply elements are aligned in accordance with the wire parallel intervals of the cut wire parts that are to be supplied with power, for each unit in accordance with the alignment positions; and the power supply elements are disposed so as to supply power to at least every other one of the cut wire parts.
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Inventors:
MIYAKE HIDETAKA (JP)
ITOKAZU ATSUSHI (JP)
HASHIMOTO TAKASHI (JP)
ITOKAZU ATSUSHI (JP)
HASHIMOTO TAKASHI (JP)
Application Number:
PCT/JP2014/055153
Publication Date:
November 27, 2014
Filing Date:
February 28, 2014
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
B23H7/10; B23H7/02
Foreign References:
| JP2011062764A | 2011-03-31 | |||
| JP2011140088A | 2011-07-21 |
Attorney, Agent or Firm:
SAKAI, HIROAKI (JP)
Hiroaki Sakai (JP)
Hiroaki Sakai (JP)
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