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Title:
WIRE ELECTRIC DISCHARGE MACHINING APPARATUS, WIRE ELECTRIC DISCHARGE MACHINING METHOD, THIN BOARD MANUFACTURING METHOD AND SEMICONDUCTOR WAFER MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2011/036924
Kind Code:
A1
Abstract:
Disclosed is a wire electric discharge machining apparatus, which is provided with: a wire electrode having a plurality of cutting wire sections, which are provided parallel to each other by being spaced apart from each other and face a subject to be machined; a machining power supply for generating a pulse-shaped machining voltage; a plurality of power feeder units, which are electrically connected to the cutting wire sections, and apply the machining voltage to between the cutting wire sections and the subject to be machined; and a nozzle, from which a machining liquid is jetted from a jetting port to between the electrodes along the cutting wire sections.

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Inventors:
MIYAKE, Hidetaka (7-3 Marunouchi 2-chome, Chiyoda-k, Tokyo 10, 〒1008310, JP)
三宅　英孝 (〒10 東京都千代田区丸の内二丁目７番３号　三菱電機株式会社内 Tokyo, 〒1008310, JP)
SATO, Tatsushi (7-3 Marunouchi 2-chome, Chiyoda-k, Tokyo 10, 〒1008310, JP)
Application Number:
JP2010/060686
Publication Date:
March 31, 2011
Filing Date:
June 23, 2010
Export Citation:
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Assignee:
Mitsubishi Electric Corporation (7-3 Marunouchi 2-chome, Chiyoda-ku Tokyo, 10, 〒1008310, JP)
三菱電機株式会社 (〒10 東京都千代田区丸の内二丁目７番３号 Tokyo, 〒1008310, JP)
MIYAKE, Hidetaka (7-3 Marunouchi 2-chome, Chiyoda-k, Tokyo 10, 〒1008310, JP)
三宅　英孝 (〒10 東京都千代田区丸の内二丁目７番３号　三菱電機株式会社内 Tokyo, 〒1008310, JP)
International Classes:
B23H7/02
Attorney, Agent or Firm:
SAKAI, Hiroaki (Sakai International Patent Office, Kasumigaseki Building 2-5, Kasumigaseki 3-chome, Chiyoda-k, Tokyo 20, 〒1006020, JP)
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