Title:
WIRE ELECTRIC DISCHARGE MACHINING APPARATUS, WIRE ELECTRIC DISCHARGE MACHINING METHOD, THIN BOARD MANUFACTURING METHOD, AND SEMICONDUCTOR WAFER MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2012/042980
Kind Code:
A1
Abstract:
Provided is a wire electric discharge machining apparatus, which is provided with: a wire electrode, a guide roller, which disposes the wire electrode in parallel by winding the wire electrode; a plurality of slide-contact conductive bodies (62), each of which is slidably in contact with the wire electrode disposed in parallel; and power-feeding jigs, which individually hold the slide-contact conductive bodies (62), and which individually feed power, via the slide-contact conductive bodies (62), to the wire electrode disposed in parallel. The power-feeding jigs are provided with a plurality of reference surfaces that determine the fixing intervals between the slide-contact conductive bodies (62).
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Inventors:
ITOKAZU ATSUSHI (JP)
MIYAKE HIDETAKA (JP)
SATO TATSUSHI (JP)
YUZAWA TAKASHI (JP)
FUKUSHIMA KAZUHIKO (JP)
MIYAKE HIDETAKA (JP)
SATO TATSUSHI (JP)
YUZAWA TAKASHI (JP)
FUKUSHIMA KAZUHIKO (JP)
Application Number:
PCT/JP2011/063578
Publication Date:
April 05, 2012
Filing Date:
June 14, 2011
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
ITOKAZU ATSUSHI (JP)
MIYAKE HIDETAKA (JP)
SATO TATSUSHI (JP)
YUZAWA TAKASHI (JP)
FUKUSHIMA KAZUHIKO (JP)
ITOKAZU ATSUSHI (JP)
MIYAKE HIDETAKA (JP)
SATO TATSUSHI (JP)
YUZAWA TAKASHI (JP)
FUKUSHIMA KAZUHIKO (JP)
International Classes:
B23H7/10; B23H7/02
Domestic Patent References:
| WO2009154199A1 | 2009-12-23 |
Foreign References:
| JP2000094221A | 2000-04-04 | |||
| JP2009166211A | 2009-07-30 | |||
| JPS5478096U | 1979-06-02 | |||
| JPS5417291U | 1979-02-03 |
Attorney, Agent or Firm:
SAKAI, HIROAKI (JP)
Hiroaki Sakai (JP)
Hiroaki Sakai (JP)
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Claims: