Title:
WIRE ELECTRICAL DISCHARGE MACHINING APPARATUS AND SEMICONDUCTOR WAFER MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2016/046922
Kind Code:
A1
Abstract:
A control unit (14) controls: a cutting process of simultaneously moving a workpiece (5) relative to cutting wire sections (CL) in an orthogonal direction along a plane perpendicular to the axial directions of main guide rollers (1a-1d) while cutting multiple wafers by electrical discharge machining and leaving a connected section in which a portion of the multiple wafers is connected to the workpiece (5) during cutting; and a shape-correction process in which the shapes of the multiple cut surfaces cut during the cutting process are simultaneously corrected by scanning the multiple cutting wire sections (CL) in the tracks left by the cutting wire sections (CL) in the cutting direction during the cutting process while performing electrical discharge machining.
Inventors:
MIYAKE HIDETAKA (JP)
HASHIMOTO TAKASHI (JP)
YUZAWA TAKASHI (JP)
HASHIMOTO TAKASHI (JP)
YUZAWA TAKASHI (JP)
Application Number:
PCT/JP2014/075295
Publication Date:
March 31, 2016
Filing Date:
September 24, 2014
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
B23H7/02
Domestic Patent References:
| WO2013153691A1 | 2013-10-17 |
Foreign References:
| JP2887635B2 | 1999-04-26 | |||
| JPS61182730A | 1986-08-15 | |||
| JPS5621733A | 1981-02-28 | |||
| JPS6257451B2 | 1987-12-01 | |||
| JP2007030155A | 2007-02-08 |
Attorney, Agent or Firm:
SAKAI, HIROAKI (JP)
Hiroaki Sakai (JP)
Hiroaki Sakai (JP)
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