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Patent Searching and Data


Title:
WIRE HARNESS
Document Type and Number:
WIPO Patent Application WO/2023/181877
Kind Code:
A1
Abstract:
The purpose of the present invention is to improve heat dissipation properties in an electric device to which a wire harness is to be connected. The wire harness comprises a circuit having at least wiring that extends from an electronic device having a heat-generating component, a thermally conductive plate that widens along the wiring, and a thermal conductor that thermally connects the circuit and the thermally conductive plate.

Inventors:
ITO HIDEAKI (JP)
MIYAWAKI DAISUKE (JP)
TAKENAKA YUJI (JP)
MIZUNO HOUSEI (JP)
Application Number:
PCT/JP2023/008233
Publication Date:
September 28, 2023
Filing Date:
March 06, 2023
Export Citation:
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Assignee:
AUTONETWORKS TECHNOLOGIES LTD (JP)
SUMITOMO WIRING SYSTEMS (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)
International Classes:
H02G3/03; H01B7/00; H02G3/04; H02G3/16
Foreign References:
JP2019176617A2019-10-10
JPH07220787A1995-08-18
JP2020127249A2020-08-20
JP2020174155A2020-10-22
JP2007048741A2007-02-22
Attorney, Agent or Firm:
YOSHITAKE Hidetoshi et al. (JP)
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