WIRE SAW APPARATUS

WIPO Patent Application WO/2012/099444

A2

The present invention relates to a wire saw apparatus for cutting an ingot. The wire saw apparatus for cutting a downwardly moving ingot according to the present invention comprises: a plurality of bobbins which are spaced apart from each other and rotate; a wire wound on the plurality of bobbins to cut an ingot; an insulating basket arranged in the spacing between the plurality of bobbins and beneath the ingot; and guide plates coupled to both sides of the insulation basket such that the guide plate faces the bobbins. Thus, a wafer which is partially broken and falls during ingot cutting may be prevented from being recognized as a disconnection of the wire, and the wafer which is partially broken and fallen in the insulation basket may be easily recognized from the outside.

WO/2002/100619	DEVICE AND METHOD FOR DETERMINING THE ORIENTATION OF A CRYSTALLOGRAPHIC PLANE IN RELATION TO A CRYSTAL SURFACE AND DEVICE FOR CUTTING A SINGLE CRYSTAL IN A CUTTING MACHINE
JP3096763	[Title of Invention] A method for cutting and cutting a semiconductor block
JP2004122287	WIRE SAW WITH WIRE BREAKAGE PREVENTION MECHANISM IN POWER FAILURE

JANG SUK JOON (KR)
PARK TAE IN (KR)
CHO CHANG SUK (KR)
CHO SANG SIK (KR)
GWAK BEOM SEOK (KR)

PCT/KR2012/000567

July 26, 2012

January 20, 2012

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OSUNG LST CO LTD (KR)
JANG SUK JOON (KR)
PARK TAE IN (KR)
CHO CHANG SUK (KR)
CHO SANG SIK (KR)
KIM HAE YEON (KR)
GWAK BEOM SEOK (KR)

B28D5/04; B28D7/00

JP2004114249A	2004-04-15
JP2000061799A	2000-02-29
JP2010194706A	2010-09-09
JP2007007848A	2007-01-18

CHO, YOUNG HYUN (KR)
조영현 (KR)

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