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Patent Searching and Data


Title:
WIRE SAW DEVICE AND METHOD FOR CUTTING WORKPIECE
Document Type and Number:
WIPO Patent Application WO/2018/012313
Kind Code:
A1
Abstract:
The present invention is a wire saw device that includes: a wire feed reel that lets out wire; wire rows formed of the wire spirally wound around a plurality of wire guides; a wire winding reel on which the wire is wound; and a workpiece holding part that holds a workpiece to be cut, wherein the wire saw device performs cutting by pressing the workpiece held by the workpiece holding part against the wire rows travelling while repeating advancing and retracting at least once. The wire saw device is characterized by having a vibration sensor that is attached to the workpiece holding part and a load cell that detects the tension of the wire. This provides a wire saw device and a method for cutting a workpiece with which it is possible to determine, before cutting the workpiece, a condition in which violent movement of the wire due to tension is occurring or in which an abnormal vibration of the wire saw device is occurring and with which it is possible to prevent degradation of the quality of wafers cut out from the workpiece.

Inventors:
USAMI Yoshihiro (Shin-Etsu Handotai Co. Ltd., 150, Aza Ohira, Oaza Odakura, Nishigo-mura, Nishishirakawa-gu, Fukushima 61, 〒9618061, JP)
Application Number:
JP2017/024063
Publication Date:
January 18, 2018
Filing Date:
June 30, 2017
Export Citation:
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Assignee:
SHIN-ETSU HANDOTAI CO.,LTD. (2-1 Ohtemachi 2-chome, Chiyoda-ku Tokyo, 04, 〒1000004, JP)
International Classes:
B24B27/06; B24B49/10; B28D5/04; H01L21/304
Domestic Patent References:
2015-12-17
Foreign References:
JP2000061809A2000-02-29
JPH1024411A1998-01-27
JP2011104688A2011-06-02
JP2000190196A2000-07-11
JPH0727603A1995-01-31
Attorney, Agent or Firm:
YOSHIMIYA Mikio et al. (1st Shitaya Bldg. 8F, 6-11 Ueno 7-chome, Taito-k, Tokyo 05, 〒1100005, JP)
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