Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
WIRE SAW DEVICE AND WAFER MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2019/130806
Kind Code:
A1
Abstract:
This wire saw device comprises: a plurality of wire guides; a wire row that is formed by a wire wound onto the plurality of wire guides and travels reciprocally in the axial direction; a nozzle that supplies coolant or slurry to the wire; a workpiece holding part that suspends and holds, via a beam, a workpiece plate on which a workpiece is attached; and a workpiece feeding mechanism that presses the workpiece against the wire row. The wire saw device is characterized by being provided with a mechanism for adjusting the degree of parallelism of the axes of the plurality of wire guides forming the wire row. Due to this configuration, a wire saw device and a wafer manufacturing method are provided with which the warp of the workpiece in the wire movement direction after cutting is controlled and a wafer having any warp shape can be manufactured.

Inventors:
MIZUSHIMA Kazutoshi (Shin-Etsu Handotai Co. Ltd., 150, Aza Ohira, Oaza Odakura, Nishigo-mura, Nishishirakawa-gu, Fukushima 61, 〒9618061, JP)
OTAKA Toshiaki (Shin-Etsu Handotai Co. Ltd., 150, Aza Ohira, Oaza Odakura, Nishigo-mura, Nishishirakawa-gu, Fukushima 61, 〒9618061, JP)
ENOMOTO Tatsuo (Shin-Etsu Handotai Co. Ltd., 2-1, Ohtemachi 2-chome, Chiyoda-k, Tokyo 04, 〒1000004, JP)
SHIMIZU Yuichi (Shin-Etsu Handotai Co. Ltd., 2-1, Ohtemachi 2-chome, Chiyoda-k, Tokyo 04, 〒1000004, JP)
Application Number:
JP2018/040633
Publication Date:
July 04, 2019
Filing Date:
November 01, 2018
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
SHIN-ETSU HANDOTAI CO., LTD. (2-1 Ohtemachi 2-chome, Chiyoda-ku Tokyo, 04, 〒1000004, JP)
International Classes:
H01L21/304; B24B27/06; B28D5/04
Attorney, Agent or Firm:
YOSHIMIYA Mikio et al. (1st Shitaya Bldg. 8F, 6-11 Ueno 7-chome, Taito-k, Tokyo 05, 〒1100005, JP)
Download PDF: