Title:
WIRE SAW DEVICE AND WAFER MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2019/130806
Kind Code:
A1
Abstract:
This wire saw device comprises: a plurality of wire guides; a wire row that is formed by a wire wound onto the plurality of wire guides and travels reciprocally in the axial direction; a nozzle that supplies coolant or slurry to the wire; a workpiece holding part that suspends and holds, via a beam, a workpiece plate on which a workpiece is attached; and a workpiece feeding mechanism that presses the workpiece against the wire row. The wire saw device is characterized by being provided with a mechanism for adjusting the degree of parallelism of the axes of the plurality of wire guides forming the wire row. Due to this configuration, a wire saw device and a wafer manufacturing method are provided with which the warp of the workpiece in the wire movement direction after cutting is controlled and a wafer having any warp shape can be manufactured.
Inventors:
MIZUSHIMA KAZUTOSHI (JP)
OTAKA TOSHIAKI (JP)
ENOMOTO TATSUO (JP)
SHIMIZU YUICHI (JP)
OTAKA TOSHIAKI (JP)
ENOMOTO TATSUO (JP)
SHIMIZU YUICHI (JP)
Application Number:
PCT/JP2018/040633
Publication Date:
July 04, 2019
Filing Date:
November 01, 2018
Export Citation:
Assignee:
SHINETSU HANDOTAI KK (JP)
International Classes:
H01L21/304; B24B27/06; B28D5/04
Foreign References:
| JP2000108012A | 2000-04-18 | |||
| JP2014133272A | 2014-07-24 | |||
| JP2010110866A | 2010-05-20 | |||
| JP2003001624A | 2003-01-08 |
Attorney, Agent or Firm:
YOSHIMIYA Mikio et al. (JP)
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