Title:
WIRE SAW DEVICE, WORKPIECE CUTTING METHOD, AND MANUFACTURING METHOD FOR WAFER
Document Type and Number:
WIPO Patent Application WO/2012/164848
Kind Code:
A1
Abstract:
The present invention maintains a constant wire deflection amount from the wire supply side to the wire collection side by reducing the tension of a wire on the wire supply side (new wire side), thereby making it possible to reduce the risk of the breaking of the wire and make the workpiece cutting capability uniform between the wire supply side and the wire collection side to thereby reduce variations in cut thickness.
A wire saw device (1) causes a cutting wire (4) wound around the outer peripheral grooves of a plurality of (here two) grooved rollers (2, 3) disposed at predetermined intervals to travel to cut a semiconductor ingot (7) that is a workpiece by a plurality of rows of the wire (4). The wire saw device comprises a tension control means (16) which, regarding the tension of the wire suspended between the groove rollers (2, 3), makes the tension of the wire on the wire collection side larger and the tension of the wire on the wire supply side smaller.
Inventors:
NAKAGAWA MASATOSHI (JP)
SAGARA TOMOYUKI (JP)
KUMADA HIROSHI (JP)
OKI NAOHIRO (JP)
SAGARA TOMOYUKI (JP)
KUMADA HIROSHI (JP)
OKI NAOHIRO (JP)
Application Number:
PCT/JP2012/003198
Publication Date:
December 06, 2012
Filing Date:
May 16, 2012
Export Citation:
Assignee:
SHARP KK (JP)
NAKAGAWA MASATOSHI (JP)
SAGARA TOMOYUKI (JP)
KUMADA HIROSHI (JP)
OKI NAOHIRO (JP)
NAKAGAWA MASATOSHI (JP)
SAGARA TOMOYUKI (JP)
KUMADA HIROSHI (JP)
OKI NAOHIRO (JP)
International Classes:
B24B27/06; B28D5/04; H01L21/304
Foreign References:
| JP2010110865A | 2010-05-20 | |||
| JPH07276218A | 1995-10-24 | |||
| JP2002233943A | 2002-08-20 |
Attorney, Agent or Firm:
YAMAMOTO, Shusaku et al. (JP)
Shusaku Yamamoto (JP)
Shusaku Yamamoto (JP)
Download PDF:
Claims: