Title:
WIRE SAW DEVICE AND WORKPIECE CUTTING METHOD
Document Type and Number:
WIPO Patent Application WO/2016/208112
Kind Code:
A1
Abstract:
Provided are a wire saw device and a workpiece cutting method which are capable of efficiently collecting spattered slurry even in an intermediate stage of a workpiece cutting process and improving the surface quality of a cut workpiece. This wire saw device comprises: at least one wire (11) that is provided in a tensioned state so as to be capable of travelling in a direction crossing a workpiece W to be cut; a workpiece holding part (12) that holds the workpiece W and moves the workpiece W relative to the wire (11); a slurry supply part (13) that supplies slurry for cutting the workpiece W to the wire (11) from the upstream side in the traveling direction of the wire (11); and a slurry collecting part (14) for collecting slurry that spatters due to contact with the workpiece W. The wire saw device is characterized in that the slurry collecting part (14) can be moved along the workpiece W in a state of being disposed adjacent to the workpiece W, and can be retracted from the workpiece W so as to be prevented from coming into contact with the wire (11).
Inventors:
FUKUDA MASAKI (JP)
MIZOKAMI KAZUTAKA (JP)
OOTA SHINJI (JP)
MIZOKAMI KAZUTAKA (JP)
OOTA SHINJI (JP)
Application Number:
PCT/JP2016/002306
Publication Date:
December 29, 2016
Filing Date:
May 11, 2016
Export Citation:
Assignee:
SUMCO CORP (JP)
International Classes:
B24B27/06; B28D5/04; B28D7/02; H01L21/304
Domestic Patent References:
| WO2009104222A1 | 2009-08-27 |
Foreign References:
| JP2013538131A | 2013-10-10 | |||
| JP2013086233A | 2013-05-13 | |||
| JP2000141220A | 2000-05-23 |
Attorney, Agent or Firm:
SUGIMURA, KENJI (JP)
Kenji Sugimura (JP)
Kenji Sugimura (JP)
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