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Patent Searching and Data


Title:
WIRE SAW DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/124465
Kind Code:
A2
Abstract:
The present invention relates to a wire saw device which slices a monocrystalline silicon ingot to produce a wafer. According to one embodiment of the present invention, a wire saw device is provided, the wire saw device comprising: an ingot supporting member for supporting the ingot; and an ingot slicing member disposed under the ingot supporting member and including a wire, which slices the ingot, and a pair of cylindrical guide rollers having a plurality of guide grooves that allow the wire to be wound on the outer circumferential surface of the guide rollers, wherein cross-sections between the plurality of guide grooves are formed in the shape of isosceles trapezoids, and support protrusions for supporting the wire are located between the plurality of guide grooves.

Inventors:
WOO NAM KYOO (KR)
JANG SOON HO (KR)
BAE DONG WOO (KR)
LEE BO RAM (KR)
BAIK SUNG SUN (KR)
Application Number:
PCT/KR2017/012840
Publication Date:
July 05, 2018
Filing Date:
November 14, 2017
Export Citation:
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Assignee:
WOONGJIN ENERGY CO LTD (KR)
International Classes:
H01L21/78; B28D5/04; H01L21/02
Attorney, Agent or Firm:
ERUUM & LEEON INTELLECTUAL PROPERTY LAW FIRM (KR)
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