Title:
WIRE SAW HAVING WIRE-BREAK MONITORING
Document Type and Number:
WIPO Patent Application WO/2011/151022
Kind Code:
A8
Abstract:
The invention relates to a method for monitoring for wire breaks while hard solids are cut by means of a span of wire, wherein the solid is guided through the span of wire, and a direct current is conducted by the span of wire. The direct current produces a voltage across the span of wire. The voltage is monitored by a sensor, which interrupts the cutting process when a voltage-deviation signal caused by a wire break is received. The invention further relates to a wire saw for carrying out said method and to the use of the method and/or of the wire saw to cut hard, preferably brittle solids, preferably metals and semimetals, preferably mono- and polycrystalline silicon crystals, ceramics, sapphire, and germanium.
Inventors:
DE AGOSTINI ANTONIO (CH)
WAELTE WILLI (CH)
WAELTE WILLI (CH)
Application Number:
PCT/EP2011/002539
Publication Date:
January 26, 2012
Filing Date:
May 21, 2011
Export Citation:
Assignee:
MEYER BURGER AG (CH)
DE AGOSTINI ANTONIO (CH)
WAELTE WILLI (CH)
DE AGOSTINI ANTONIO (CH)
WAELTE WILLI (CH)
International Classes:
B26D1/547; B23D57/00; B23Q17/09; B26D5/00; B28D5/04
Attorney, Agent or Firm:
KASCHE, André (Resirain 1, Zollikerberg, CH)
Download PDF:
Previous Patent: DEVICE FOR LEADING AWAY A MATERIAL EMANATING FROM THE SEABED AND METHOD
Next Patent: SWITCHING DEVICE FOR CONDUCTING A FLUID
Next Patent: SWITCHING DEVICE FOR CONDUCTING A FLUID