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Title:
WIRE SAW AND WORKPIECE MACHINING METHOD EMPLOYING SAME
Document Type and Number:
WIPO Patent Application WO/2014/010468
Kind Code:
A1
Abstract:
Provided is a wire saw in which a wire (47) is wound between a plurality of machining rollers (45), and the wire (47) is moved around the machining rollers (45) by rotation of said machining rollers (45), whereby a workpiece (49) is cut by means of the wire (47) at a workpiece cutting position. The wire saw is provided with a supply pallet (67) which guides the workpiece (49) in such a way that said workpiece (49) is moved in an upright state towards the wire (47) at the workpiece cutting position. The wire saw is disposed at a workpiece receiving position set downstream of the workpiece cutting position, and is also provided with a receiving pallet (100) for receiving the cut workpiece (49) in the upright state.

Inventors:
NAKAMOTO HIROSHI (JP)
KAWATSU TOMOYUKI (JP)
ISHIZUKA SATOSHI (JP)
HIMATA AKINORI (JP)
SATAKE TAKAFUMI (JP)
Application Number:
PCT/JP2013/068113
Publication Date:
January 16, 2014
Filing Date:
July 02, 2013
Export Citation:
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Assignee:
KOMATSU NTC LTD (JP)
International Classes:
B24B27/06
Foreign References:
JP2006082173A2006-03-30
JP2000326324A2000-11-28
JP2011143510A2011-07-28
JP2000271848A2000-10-03
JPH0524034A1993-02-02
JP2011212781A2011-10-27
JPH11129152A1999-05-18
JP2010023225A2010-02-04
JP2002264003A2002-09-18
JPH07308917A1995-11-28
JPH11188601A1999-07-13
JPH11165250A1999-06-22
JPH11188600A1999-07-13
Attorney, Agent or Firm:
ONDA, Makoto et al. (JP)
Makoto Onda (JP)
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