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Title:
WIRE SAW
Document Type and Number:
WIPO Patent Application WO/2011/021784
Kind Code:
A3
Abstract:
The present invention relates to a wire saw, and particularly, to a wire saw that includes a partial coating layer formed on only a portion of ultrafine particle surfaces, in order to prevent the ultrafine particles from being over-deposited on a core line and also to enable the partial coating layer to be easily formed on the ultrafine particles.

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Inventors:
RYOO MINHO (KR)
LEE HYOUNGYOON (KR)
JEONG YONGWHA (KR)
Application Number:
PCT/KR2010/004752
Publication Date:
April 14, 2011
Filing Date:
July 21, 2010
Export Citation:
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Assignee:
ILJIN DIAMOND CO LTD (KR)
RYOO MINHO (KR)
LEE HYOUNGYOON (KR)
JEONG YONGWHA (KR)
International Classes:
B23D61/18; B28D1/08; C04B35/515
Foreign References:
JP2007500082A2007-01-11
JP2004050301A2004-02-19
JP2008221406A2008-09-25
Attorney, Agent or Firm:
DARAE IP FIRM (647-9 Yeoksam-dong, Gangnam-gu, Seoul 135-080, KR)
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